Union Semiconductor (Hefei) Co., Ltd.

Chinese packaging and testing provider for display driver chips

What Union Semiconductor does

Union Semiconductor finishes and tests display driver chips, the chips that control the pixels on a screen. Chip design companies send it their wafers. It adds tiny metal bumps to them, tests each chip on the wafer, and then attaches the chips to glass or flexible film so they can go into displays. These chips end up in phones, TVs, laptops, tablets, cars, wearables and electronic tags.

How Union Semiconductor makes money

It charges display driver chip design companies in China and abroad for outsourced back-end processing services: bumping, wafer probing, and COG/COF assembly.

Products & services

• Gold bump manufacturing (bumping)
• Wafer testing (CP)
• Chip on glass (COG) packaging
• Chip on film (COF) packaging
• Display driver IC packaging and testing services