JCET Group Co., Ltd.

Chinese chip packaging and testing services provider

What JCET does

JCET does the final steps of making computer chips. After a chip is made on a silicon wafer, JCET tests it, puts it in a protective package that connects it to a circuit board, and tests it again. It also helps customers design chip packages and ships the finished chips to them around the world.

How JCET makes money

It earns service fees from chip companies that outsource packaging, testing and related design and analysis work, often as a turnkey package from wafer to shipped part. Sewage treatment, investment and trading bring in smaller amounts.

Products & services

• Turnkey packaging and test solutions
• Flip chip and wirebond packaging
• Wafer-level packaging and wafer bumping
• System-in-package (SiP)
• Power device and MEMS/sensor packaging
• Wafer sort and final testing (RF, mixed-signal, memory, digital)