Hefei Chipmore Technology Co.,Ltd.

Chinese chip packaging and testing firm focused on display driver chips

What Hefei Chipmore does

Chipmore packages and tests computer chips that other companies design. It takes finished silicon wafers, adds tiny connection bumps, tests them, cuts them into individual chips and packages them so they can go into devices. Most of its work is on chips that drive screens, manage power and handle wireless signals in TVs, phones, cars and laptops.

How Hefei Chipmore makes money

It charges chip design customers service fees for outsourced back-end steps such as bumping, wafer testing, grinding, cutting, packaging and final testing. It also earns revenue from engineering support like photomask, substrate and tape design, test program development, and probe card design and repair.

Products & services

• Bump processing
• Wafer testing (CP)
• Grinding, cutting and packaging (incl. COF/flip-chip film)
• Display driver chip packaging and testing
• Power management and RF front-end chip packaging and testing
• Test program development and probe card/POGO PIN services