Forehope Electronic (Ningbo) Co., Ltd.

Chinese advanced chip packaging and testing company

What Forehope Electronic does

Forehope Electronic packages and tests computer chips. After chips are made on silicon wafers, the company encloses and connects them so they can be mounted in electronic devices. Its packaged chips go into Internet of Things devices, 5G equipment, and AI and big data applications.

How Forehope Electronic makes money

It earns revenue by packaging and testing chips for customers across several package types, including bumping, wafer-level, BGA, QFN/QFP, flip-chip and system-in-package. It also charges for design services for substrates, lead-frames and wafer packages.

Products & services

• Bumping and wafer-level packaging
• Ball grid array (BGA) packages
• QFN and QFP packages
• Flip-chip packaging
• System in package (SiP)
• Substrate, lead-frame and wafer package design services