China Wafer Level CSP Co., Ltd.

Chinese wafer-level packaging and testing specialist for image sensor chips

What China Wafer Level CSP does

China Wafer Level CSP packages and tests semiconductor chips, mainly at the wafer level. That means it adds the protective casing and electrical connections chips need before they go into phones and other devices. Its work covers image sensors, fingerprint (biometric) chips and ambient light sensors, and it also offers chip design support, reliability testing and failure analysis.

How China Wafer Level CSP makes money

It earns fees from chip design houses and mobile handset makers for packaging, testing and assembly work, including TSV and 3D integration. It also sells sensor chips and related engineering services such as design, prototyping and reliability testing.

Products & services

• Wafer-level chip-scale packaging (WLCSP)
• TSV and 3DIC manufacturing services
• Image sensor chip packaging
• Biometric identification and ambient light sensor chips
• Wire bond and flip chip assembly
• Reliability testing and failure analysis